How Quality Management Systems Are Established



In electronic devices, printed circuit boards, or PCBs, are utilized to mechanically support electronic parts which have their connection leads soldered onto copper pads in surface area mount applications or through rilled holes in the board and copper pads for soldering the element leads in thru-hole applications. A board style might have all thru-hole elements on the top or component side, a mix of thru-hole and surface mount on the top side only, a mix of thru-hole and surface mount elements on the top side and surface install components on the bottom or circuit side, or surface install parts on the leading and bottom sides of the board.

The boards are likewise used to electrically connect the required leads for each element utilizing conductive copper traces. The component pads and connection traces are etched from copper sheets laminated onto a non-conductive substrate. Printed circuit boards are created as single agreed copper pads and traces on one side of the board only, double agreed copper pads and traces on the leading and bottom sides of the board, or multilayer styles with copper pads and traces on the top and bottom of board with a variable number of internal copper layers with traces and connections.

Single or double sided boards include a core dielectric product, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is engraved away to form the actual copper pads and connection traces on the board surfaces as part of the board manufacturing procedure. A multilayer board consists of a number of layers of dielectric product that has actually been fertilized with adhesives, and these layers are used to separate the layers of copper plating. All of these layers are aligned then bonded into a single board structure under heat and pressure. Multilayer boards with 48 or more layers can be produced with today's technologies.

In a typical 4 layer board style, the internal layers are frequently utilized to provide power and ground connections, such as a +5 V plane layer and a Ground airplane layer as the 2 internal layers, with all other circuit and part connections made on the top and bottom layers of the board. Really intricate board designs might have a a great deal of layers to make the different connections for various voltage levels, ground connections, or for connecting the many leads on ball grid range devices and other large incorporated circuit bundle formats.

There are usually 2 kinds of material used to build a multilayer board. Pre-preg product is thin layers of fiberglass pre-impregnated with an adhesive, and is in sheet form, typically about.002 inches thick. Core product is similar to an extremely thin double sided board because it has a dielectric material, such as epoxy fiberglass, with a copper layer deposited on each side, typically.030 density dielectric product with 1 ounce copper layer on each side. In a multilayer board design, there are two approaches used to build up the desired number of layers. The core stack-up technique, which is an older innovation, utilizes a center layer of pre-preg material with a layer of core material above and another layer of core product below. This mix of one pre-preg layer and 2 core layers would make a 4 layer board.

The film stack-up technique, a more recent innovation, would have core material as the center layer followed by layers of pre-preg and copper material developed above and listed below to form the last number of layers required by the board style, sort of like Dagwood constructing a sandwich. This method permits the manufacturer versatility in how the board layer densities are combined to satisfy the ended up product thickness requirements by differing the variety of sheets of pre-preg in each layer. When the material layers are finished, the entire stack is subjected to heat and pressure that causes the adhesive in the pre-preg to bond the core and pre-preg layers together into a single entity.

The procedure of manufacturing printed circuit boards follows the steps below for a lot of applications.

The process of identifying products, processes, and requirements to fulfill the consumer's specifications for the board style based on the Gerber file info offered with the purchase order.

The process of moving the Gerber file information for a layer onto an etch withstand film that is placed on the conductive copper More interesting details here layer.

The standard process of exposing the copper and other areas unprotected by the etch resist movie to a chemical that eliminates the vulnerable copper, leaving the safeguarded copper pads and traces in place; more recent procedures use plasma/laser etching instead of chemicals to remove the copper product, permitting finer line definitions.

The process of aligning the conductive copper and insulating dielectric layers and pressing them under heat to trigger the adhesive in the dielectric layers to form a solid board material.

The procedure of drilling all of the holes for plated through applications; a 2nd drilling process is utilized for holes that are not to be plated through. Information on hole place and size is included in the drill drawing file.

The process of applying copper plating to the pads, traces, and drilled through holes that are to be plated through; boards are put in an electrically charged bath of copper.

This is required when holes are to be drilled through a copper location but the hole is not to be plated through. Prevent this procedure if possible because it includes expense to the finished board.

The procedure of using a protective masking material, a solder mask, over the bare copper traces or over the copper that has actually had a thin layer of solder applied; the solder mask protects versus ecological damage, supplies insulation, safeguards versus solder shorts, and protects traces that run in between pads.

The procedure of finishing the pad locations with a thin layer of solder to prepare the board for the ultimate wave soldering or reflow soldering procedure that will take place at a later date after the components have been positioned.

The procedure of applying the markings for part classifications and component outlines to the board. Might be used to simply the top or to both sides if parts are installed on both leading and bottom sides.

The process of separating numerous boards from a panel of identical boards; this process likewise enables cutting notches or slots into the board if required.

A visual evaluation of the boards; also can be the process of inspecting wall quality for plated through holes in multi-layer boards by cross-sectioning or other methods.

The process of checking for connection or shorted connections on the boards by means applying a voltage between various points on the board and determining if an existing circulation happens. Relying on the board intricacy, this procedure might require a specially developed test fixture and test program to incorporate with the electrical test system utilized by the board producer.